Chinese giant Huawei has announced plans to design high-end chips with a transistor density equivalent to 1,4 nanometer technology by 2031, despite US sanctions that limit China's access to advanced technologies.
In a statement released Monday, Huawei introduced what it calls the "Tau scaling law," a new approach designed to improve semiconductor performance without relying primarily on transistor miniaturization, which has become increasingly complex and expensive for the global industry.
He Tingbo, president of Huawei's semiconductor division and director of the group's scientific committee, outlined this strategy at the IEEE International Circuits and Systems Symposium (ISCAS) 2026 in Shanghai.
According to Huawei, this approach prioritizes new methods of chip architecture and optimization to increase their power and energy efficiency, while US restrictions complicate China's access to the most advanced manufacturing equipment.
The objective set by the Chinese group is particularly ambitious, with 1,4 nm technology being considered close to the global frontier of semiconductor manufacturing expected by the end of the decade.
However, Huawei has not presented any independent data to verify the actual performance of this future technology.
Sanctions imposed by Washington in recent years have severely limited Chinese companies' access to Western equipment and software needed to produce the most advanced chips, pushing Beijing to accelerate its efforts to develop an independent domestic industry.
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